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PRODUCTS

Products

Bumping & WLP

Through the Bumping and RDL technology of Wafer Level Packaging, the I/O re-layout and solder / copper pillar bumps on the surface of the wafer are used to realize the bump processing of Flip-Chip

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Bumping & WLP

BGA Package

BGA(Ball Grid Array): Interconnection of chip and substrate is realized by using Die bond/Wire bond or advanced normal chip combine with Flip chip named Hybrid BGA technology

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BGA Package

QFN/QFP Lead Frame Package

QFN (Quad Flat No-Lead Package) and QFP (Quad Flat Package): Base on copper Lead Frame QFN and QFP packages with large exposed pads in the center of the package for thermal conduction

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QFN/QFP Lead Frame Package

MEMS/Optical Sensor Package

MEMS (Micro Electro Mechanical Systems) Microphones: Microphones based on MEMS technology are capacitors integrated on micro-silicon wafers and manufactured using a surface-mount process that can withstand high reflow temperatures

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MEMS/Optical Sensor Package

Flip-Chip

FCCSP/FCBGA (Flip-chip CSP/BGA): Advanced high-precision Flip chip level packages with Cu pillar or Solder bump by flipping the chip over and attaching it to the substrate

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Flip-Chip

SiP(System in Package)

SiP(System in Package): From the traditional Single chip with passive components, developing to Multi chip multifunctional chip with passive components, including normal chip (Die bond/Wire bond) and Flip chip hybrid packaging technology

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SiP(System in  Package)

News

About Forehope Electronics
Forehope Electronic (Ningbo) Co., Ltd. was listed in November 2022 on the Science and Technology Board of the Stock Exchange, Stock Name: Forehope Electronics, Stock Code: 688362. The company was founded in November 2017, mainly engaged in the development of integrated circuit packaging and testing solutions, assembly and test of different types of integrated circuit chips.
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  • Commitment

    Commitment

    We stick to our commitments to customers, suppliers, employees, shareholders, and once we make a commitment, we will do our best to support.
  • Fairness

    Fairness

    Establishing a fair and open management model, creating a serious and lively working environment.
  • Cooperation

    Cooperation

    Focus on assembly and testing. Emphasis on long-term strategy and teamwork, and pursuit of sustainable management.

News

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